A new wafer inspection platform combines AI analytics, sub-micron imaging, SWIR sensing, and precision metrology to help ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Researchers from Northwestern University, University of Virginia, Carnegie Mellon University, and Argonne National Laboratory have made a significant advancement in defect detection and process ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Physicists predict that numerous 'defects' formed during the explosive expansion of the early universe. Now, a Korean research team has experimentally demonstrated for the first time in nearly 40 ...

Discover how Lean Six Sigma enhances performance by combining Six Sigma and Lean methods to reduce waste and defects, ...

Understanding your company’s manufacturing process and how to minimize defects has always been important. Today, its importance is increasing with the complexity of products and the customers' demand ...