The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult ...

New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...

(MENAFN- EIN Presswire) EINPresswire/ -- congatec – a leading vendor of embedded and edge computing building blocks – today launched the industry's broadest portfolio of Computer-on-Modules (COMs) ...

Texas Instruments (NasdaqGS:TXN) has introduced new isolated power modules that use its proprietary IsoShield packaging ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

MINNEAPOLIS--(BUSINESS WIRE)--Logic PD today revealed the industry’s smallest embedded modules: the Torpedo System on Modules (SOM) based on Texas Instruments’ DM3730 DaVinci™ video processor and ...