The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on ...

Hsinchu, Taiwan, December 21, 2017 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced the availability of the company’s 40nm ...

As 40-nanometer NAND flash products are prepared for mass production, and as technologies emerge to achieve densities beyond 2 bits per cell (multilevel-cell technology), with 3- and 4-bit/cell ...

A world-first technology has been developed by introducing a roll-to-roll compatible flash process into secondary battery electrode manufacturing, significantly suppressing the performance degradation ...

M31's SRAM Compiler IP solutions on TSMC's 28nm Embedded Flash process technology will enhance SoC designs on power and performance for mobile, power management, IoT, and automotive electronics ...

Spansion Inc. and United Microelectronics Corporation announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT ...

Taiwan Semiconductor Manufacturing Company (TSMC) has qualified its 0.13-micron embedded flash process and is set to begin production. According to a company release, TSMC is the first pure-play ...