Nasdaq

II-VI Incorporated Introduces Laser Lapping System for Diamond and Superhard Materials ...

PITTSBURGH, Aug. 20, 2020 (GLOBE NEWSWIRE) -- II‐VI Incorporated (Nasdaq: IIVI), a leading provider of laser technologies for materials processing, today announced the introduction of its L45 laser ...
AZOM

Optimize Wafer Lapping Using MTI’s Real-Time Monitoring Tech

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
AZOM

Real-Time Thickness Monitoring in Semiconductor Wafer Lapping

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
Nasdaq

II-VI Incorporated Adds Profile-Shaping Laser to Its Lineup of High-Precision Surface ...

PITTSBURGH, March 16, 2022 (GLOBE NEWSWIRE) -- II‐VI Incorporated (Nasdaq: IIVI), a leading provider of laser technologies for materials processing, today announced the introduction of its advanced ...