High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

Samsung's new codename Shinebolt HBM3e memory features 12-Hi 36GB HBM3e stacks with 12 x 24Gb memory devices placed on a logic die featuring a 1024-bit memory interface. Samsung's new 36GB HBM3e ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Edge AI—enabling autonomous vehicles, medical sensors, and industrial monitors to learn from real-world data as it arrives—can now adopt learning models on the fly while keeping energy consumption and ...

GridGain Systems today announced the availability of what is being touted as the industry’s first end-to-end In-Memory Computing infrastructure stack. The GridGain Stack includes high performance ...