本文来自“COMSOL”，文章仅代表作者观点，与“环球科学科研圈”无关。 COMSOL 多物理场仿真软件的最新版本带来了 “放电模块”、GPU 加速，以及全面提升软件性能的一系列更新。 COMSOL 于 2024 年 11 月 19 日发布了 COMSOL Multiphysics® 6.3 版本。新版本带来了众多 ...

在面向工程仿真的CAE软件中，有一款叫做COMSOL的软件，对接的用户主要是高校科研人员、军工单位、高新企业研发工程师以及跨国公司工程师。其在功率器件封装的多物理场仿真分析方面功能非常强大。 在面向工程仿真的CAE软件中，有一款叫做COMSOL的软件，对接 ...

COMSOL 多物理场仿真软件的最新版本带来全新的代理模型功能和更快的求解器技术。 美国马萨诸塞州，伯灵顿（2023 年 11 月 7 日）——业界领先的多物理场仿真软件和解决方案提供商 COMSOL 公司发布了 COMSOL Multiphysics ® 6.2 版本，新增的数据驱动代理模型为仿真 ...

Digitally prototyping complex designs, such as large physical structures, biological features, and micro-electromechanical systems (MEMS) requires supercomputers running sophisticated multiphysics ...

Register now for COMSOL Day: MedTech, 21st May, hosted by multiphysics simulation software provider COMSOL, and hear talks ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

Complex technologies are forcing automotive engineers to work in areas outside their fields of expertise. A mechanical engineer, for instance, can be called upon to use electronics, fluid dynamics and ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...