The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

Texas Instruments (TI) today unveiled new isolated power modules, helping enable increased power density, efficiency and ...

TI’s new isolated power modules use IsoShield packaging to deliver higher power density, smaller footprints, and reinforced ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

The UCC34141‑Q1 and UCC33420 modules use TI’s proprietary IsoShield packaging technology, which integrates a planar ...

Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" report has been added to ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...