Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV ‑ D3 mSiC ® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions centered on wide bandgap (WBG) materials including silicon carbide (SiC) and ...

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...