Back in November 2024, we wrote about Qualcomm's QCC730M and QCC74xM modules for low-power IoT devices, but at the time, ...

Abstract: Due to an increasing demand in miniaturization of power converter, power loss densities increase significantly, which makes their thermal management difficult. One way to face this challenge ...

A compact, high‑precision bioimpedance front‑end PCB based on the Analog Devices AD5941—designed as a two‑layer board for low‑cost fabrication. The BioScan‑AD5941 Two‑Layer PCB is a mixed‑signal board ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Why is AI so power-hungry? Vertical vs. lateral power delivery. Details on the Infineon-Delta VPD solution. Infineon expanded its existing collaboration with Delta Electronics to develop ...

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics (FGEL), marking a ...

Draw the map and make it happen. As the saying goes, Rome wasn’t built in a day. That doesn’t refer to the city-state as we know it, but rather the empire as it was back in the day for my hometown of ...

As data rates soar into the multi-gigabit range, high-speed digital (HSD) PCB design is no longer just about connecting the dots. Signal integrity (SI) and power integrity (PI) challenges can silently ...

Abstract: In this article, the design and characterization of a 1200 V, 200 A rated printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge is being presented. The layout of the ...

Integrating liquid-metal packaging into a SiC half-bridge power module is an innovative solution to longstanding challenges. Silicon carbide power devices offer high-level performance in power ...